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229601

Sigma-Aldrich

Copper(II) acetate monohydrate

greener alternative

99.99% trace metals basis

Synonym(s):

Cupric acetate monohydrate

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About This Item

Linear Formula:
Cu(CO2CH3)2 · H2O
CAS Number:
Molecular Weight:
199.65
Beilstein:
3730548
EC Number:
MDL number:
UNSPSC Code:
12352103
PubChem Substance ID:
NACRES:
NA.23

vapor density

6.8 (vs air)

Assay

99.99% trace metals basis

form

powder or crystals

reaction suitability

core: copper

greener alternative product characteristics

Catalysis
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SMILES string

O.CC(=O)O[Cu]OC(C)=O

InChI

1S/2C2H4O2.Cu.H2O/c2*1-2(3)4;;/h2*1H3,(H,3,4);;1H2/q;;+2;/p-2

InChI key

NWFNSTOSIVLCJA-UHFFFAOYSA-L

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General description

Copper (II) acetate monohydrate is soluble in water and slightly soluble in methanol, diethylether and acetone. It can be synthesized by reacting acetic acid with copper (II) carbonate or copper(II) hydroxide or copper (II) oxide. Large scale commercial production is undertaken by placing copper metal in the presence of air and refluxing acetic acid. As a transition metal acetate, it can be used to form oxide nanoparticles by sonochemical methods.
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Application

Used in the synthesis of copper oxide nanoparticles, Cu2ZnSnS4 films, which find applications in solar cells. It may be used in Zinc Oxide varistors, as a catalyst in the polymerization of organic materials and as a mordant in the dying of textiles. Industrially, it may be used as a ceramic pigment and as a fungicide.

Signal Word

Danger

Hazard Statements

Hazard Classifications

Acute Tox. 4 Oral - Aquatic Acute 1 - Aquatic Chronic 2 - Eye Dam. 1 - Skin Corr. 1B

Storage Class Code

8B - Non-combustible corrosive hazardous materials

WGK

WGK 3

Flash Point(F)

does not flash

Flash Point(C)

does not flash

Personal Protective Equipment

dust mask type N95 (US), Eyeshields, Gloves

Certificates of Analysis (COA)

Search for Certificates of Analysis (COA) by entering the products Lot/Batch Number. Lot and Batch Numbers can be found on a product’s label following the words ‘Lot’ or ‘Batch’.

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Articles

Copper metal deposition processes are an essential tool for depositing interconnects used in microelectronic applications, giving group 11 (coinage metals: Copper, Silver, and Gold) an important place in atomic layer deposition (ALD) process development.

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