Skip to Content
Merck
All Photos(1)

Key Documents

View All Documentation

164410

Sigma-Aldrich

Benzocyclobutene

97%

Synonym(s):

Bicyclo[4.2.0]octa-1,3,5-triene

Sign Into View Organizational & Contract Pricing
All Photos(1)

About This Item

Empirical Formula (Hill Notation):
C8H8
CAS Number:
694-87-1
Molecular Weight:
104.15
MDL number:
MFCD01321219
UNSPSC Code:
12352100
PubChem Substance ID:
24850072
NACRES:
NA.22

Quality Level

100

Assay

97%

form

liquid

refractive index

n20/D 1.541 (lit.)

bp

150 °C/748 mmHg (lit.)

density

0.957 g/mL at 25 °C (lit.)

SMILES string

C1Cc2ccccc12

InChI

1S/C8H8/c1-2-4-8-6-5-7(8)3-1/h1-4H,5-6H2

InChI key

UMIVXZPTRXBADB-UHFFFAOYSA-N

Application

Benzocyclobutene was used as the adhesive bonding material in adhesive wafer-level bonding technique. Photosensitive benzocyclobutene has been widely used as dielectric material in multilayer packaging applications. It was used in fabrication of high density multilayer interconnect structures using gold metallization and polymer interlayer dielectric.

Pictograms

Flame
GHS02

Signal Word

Warning

Hazard Statements

H226

Hazard Classifications

Flam. Liq. 3

Storage Class Code

3 - Flammable liquids

WGK

WGK 3

Flash Point(F)

96.8 °F - closed cup

Flash Point(C)

36 °C - closed cup

Personal Protective Equipment

dust mask type N95 (US), Eyeshields, Gloves

Choose from one of the most recent versions:

Certificates of Analysis (COA)

Lot/Batch Number
MKCW5239
MKCS1608
MKCQ5398
MKCQ0059
MKCM7749

Don't see the Right Version?

If you require a particular version, you can look up a specific certificate by the Lot or Batch number.

Search for a COA

Already Own This Product?

Find documentation for the products that you have recently purchased in the Document Library.

Visit the Document Library

Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities.
Oberhammer J, et al.
Sens. Actuators, 105(3), 297-304 (2003)
Processing and microwave characterization of multilevel interconnects using benzocyclobutene dielectric.
Chinoy PB and Tajadod J.
IEEE Transactions on Components, Hybrids, and Manufacturing, 16(7), 714-719 (1993)
Photosensitive benzocyclobutene for stress-buffer and passivation applications (one mask manufacturing process).
Strandjord AJG, et al.
Electronic Components and Technology Conference, 1997. Proceedings., 47th. IEEE, 47 (1997)

Articles

Organic Materials for Thin Film Transistors

Flexible electronic circuits, displays, and sensors based on organic active materials will enable future generations of electronics products that may eventually enter the mainstream electronics market.

Organic Materials for Thin Film Transistors

Flexible electronic circuits, displays, and sensors based on organic active materials will enable future generations of electronics products that may eventually enter the mainstream electronics market.

Organic Materials for Thin Film Transistors

Flexible electronic circuits, displays, and sensors based on organic active materials will enable future generations of electronics products that may eventually enter the mainstream electronics market.

Organic Materials for Thin Film Transistors

Flexible electronic circuits, displays, and sensors based on organic active materials will enable future generations of electronics products that may eventually enter the mainstream electronics market.

Our team of scientists has experience in all areas of research including Life Science, Material Science, Chemical Synthesis, Chromatography, Analytical and many others.

Contact Technical Service