901655
Electroless nickel plating solution
ammonia free
Synonyme(s) :
Nickelex
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About This Item
Code UNSPSC :
12352303
Nomenclature NACRES :
NA.23
Produits recommandés
Forme
liquid
Couleur
blue to green
pH
4.8-5.2
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Catégories apparentées
Description générale
Electroless nickel plating solution (Nickelex) is a type of auto-catalytic plating in which many reactions occur in an aqueous solution without any external power source. Its process includes the catalytic reduction of nickel in an aqueous solution. Nickelex produces an amorphous deposition of nickel in the as-plated condition. It shows properties such as good hardness, corrosion resistance and wear resistance.
Stable electroless nickel plating composition, ready to use, specified for making ohmic contacts to silicon and other semiconductor materials
Advantages
The chemical reaction during the electroless plating process involves an oxidation-reduction reaction between nickelous and hypophosphite ions. The reaction is essentially a two step process occurring simultaneously.
(1) H2PO2- + H2O --> H2OPO3- + H2
(2) Ni ++ (complex) + H2 --> Ni + 2H+
The reaction progresses catalytically with nickel deposition occurring at the operating temperature of 95 °C - 100 °C. The nascent hydrogen evolved insures an oxide free nickel deposit. In addition some NiP formed in a side reaction improves corrosion resistance and solderability. The nickel deposit is highly conductive, remains unstressed, particularly after suitable heat treatment, and shows good adherence.
Advantages
- Stable, ready to use
- Plates without generating ammonia fumes
- Produces quality electrical contacts on p- and n-type silicon
- Does not compensate for p- or n- type conductivity
- Excellent adhesion and solderability
- Plates on silicon, germanium, gallium arsenide, cadmium sulfide
The chemical reaction during the electroless plating process involves an oxidation-reduction reaction between nickelous and hypophosphite ions. The reaction is essentially a two step process occurring simultaneously.
(1) H2PO2- + H2O --> H2OPO3- + H2
(2) Ni ++ (complex) + H2 --> Ni + 2H+
The reaction progresses catalytically with nickel deposition occurring at the operating temperature of 95 °C - 100 °C. The nascent hydrogen evolved insures an oxide free nickel deposit. In addition some NiP formed in a side reaction improves corrosion resistance and solderability. The nickel deposit is highly conductive, remains unstressed, particularly after suitable heat treatment, and shows good adherence.
Application
Nickelex can be deposited on p-type porous silicon for potential usage in light-emitting diodes (LEDs), and organic solar cells.
Use of Nickelex:
Instructions
Complete metallization procedures are provided for silicon rectifier and planar device fabrication. These procedures should be followed to obtain optimum adhesion of nickel and quality of the ohmic contacts.
- Nickelex provides good mechanical and electrical contacts for semicodonductor devices (silicon rectifers, solar cells, varactors, microwave diodes, transistors, microcircuits, etc.). The quality of the electrical contact is excellent if the surface of silicon is abraded by lapping to increase surface recombination velocity; if the surface is highly doped from diffusion; or if the semicondcutor resistivity is low (0.1 ohm-cm). Nickelex also produces adherent deposits on germanium, gallium arsenide, and cadmium sulfide.
- The Nickelex plate exhibits excellent solderability with lead, tin, and Pb/Sn alloys. Flux can be omitted when furnaced soldered in a hydrogen or non-oxidizing atmosphere.
Instructions
Complete metallization procedures are provided for silicon rectifier and planar device fabrication. These procedures should be followed to obtain optimum adhesion of nickel and quality of the ohmic contacts.
Mention d'avertissement
Danger
Mentions de danger
Conseils de prudence
Classification des risques
Acute Tox. 3 Dermal - Acute Tox. 3 Oral - Acute Tox. 4 Inhalation - Aquatic Acute 1 - Aquatic Chronic 1 - Carc. 1A Inhalation - Eye Irrit. 2 - Muta. 2 - Repr. 1B - Resp. Sens. 1 - Skin Irrit. 2 - Skin Sens. 1 - STOT RE 1
Organes cibles
Lungs
Code de la classe de stockage
6.1C - Combustible acute toxic Cat.3 / toxic compounds or compounds which causing chronic effects
Classe de danger pour l'eau (WGK)
WGK 3
Point d'éclair (°F)
Not applicable
Point d'éclair (°C)
Not applicable
Certificats d'analyse (COA)
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Les clients ont également consulté
Electroless nickel plating on silicon carbide nanoparticles
Chen Y, et al.
Surface and Coatings Technology, 172(1), 90-94 (2003)
Electroless nickel plating-a review
Loto CA
Silicon, 8(2), 177-186 (2016)
Electroless deposition and silicidation of Ni contacts into p-type Porous Silicon
Andersson HA, et al.
Journal of Porous Materials, 15(3), 335-341 (2008)
Flexible, transparent contacts for inorganic nanostructures and thin films
Turner-Evans DB, et al.
Advanced Materials, 25(29), 4018-4022 (2013)
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