Skip to Content
Merck
All Photos(2)

Documents

706493

Sigma-Aldrich

(3-Aminopropyl)triethoxysilane

packaged for use in deposition systems, ≥98%

Synonym(s):

3-Triethoxysilylpropylamine, APTES, APTS

Sign Into View Organizational & Contract Pricing


About This Item

Linear Formula:
H2N(CH2)3Si(OC2H5)3
CAS Number:
Molecular Weight:
221.37
Beilstein:
1754988
EC Number:
MDL number:
UNSPSC Code:
12352103
PubChem Substance ID:
NACRES:
NA.23

Quality Level

Assay

≥98%

form

liquid

bp

217 °C/760 mmHg (lit.)

density

0.946 g/mL at 25 °C (lit.)

SMILES string

CCO[Si](CCCN)(OCC)OCC

InChI

1S/C9H23NO3Si/c1-4-11-14(12-5-2,13-6-3)9-7-8-10/h4-10H2,1-3H3

InChI key

WYTZZXDRDKSJID-UHFFFAOYSA-N

Looking for similar products? Visit Product Comparison Guide

General description

Atomic number of base material: 14 Silicon

Pictograms

CorrosionExclamation mark

Signal Word

Danger

Hazard Statements

Hazard Classifications

Acute Tox. 4 Oral - Eye Dam. 1 - Skin Corr. 1B - Skin Sens. 1

Storage Class Code

8A - Combustible corrosive hazardous materials

WGK

WGK 1

Flash Point(F)

199.4 °F - closed cup

Flash Point(C)

93 °C - closed cup

Personal Protective Equipment

dust mask type N95 (US), Eyeshields, Gloves

Certificates of Analysis (COA)

Search for Certificates of Analysis (COA) by entering the products Lot/Batch Number. Lot and Batch Numbers can be found on a product’s label following the words ‘Lot’ or ‘Batch’.

Already Own This Product?

Find documentation for the products that you have recently purchased in the Document Library.

Visit the Document Library

Erhan Zor et al.
Biosensors & bioelectronics, 42, 321-325 (2012-12-05)
A new electrochemical biosensor based on the human serum albumin/graphene oxide/3-aminopropyl-triethoxysilane modified indium tin oxide electrode (ITO/APTES/GO/HSA) has been developed for the discrimination of tryptophan (Trp) enantiomers.The electrode has been characterized by scanning electron microscopy (SEM) and electrochemical techniques. The
Sri Ram Krishna Vedula et al.
Nature communications, 6, 6111-6111 (2015-01-23)
The closure of gaps within epithelia is crucial to maintain its integrity during biological processes such as wound healing and gastrulation. Depending on the distribution of extracellular matrix, gap closure occurs through assembly of multicellular actin-based contractile cables or protrusive
Isabelle Bonnet et al.
Nucleic acids research, 36(12), 4118-4127 (2008-06-12)
The restriction endonuclease EcoRV can rapidly locate a short recognition site within long non-cognate DNA using 'facilitated diffusion'. This process has long been attributed to a sliding mechanism, in which the enzyme first binds to the DNA via nonspecific interaction
Fei Ge et al.
Journal of hazardous materials, 211-212, 366-372 (2012-01-03)
We prepared novel Fe(3)O(4) magnetic nanoparticles (MNPs) modified with 3-aminopropyltriethoxysilane (APS) and copolymers of acrylic acid (AA) and crotonic acid (CA). The MNPs were characterized by transmission electron microscopy, X-ray diffraction, infra-red spectra and thermogravimetric analysis. We explored the ability
Dan Zheng et al.
Talanta, 99, 22-28 (2012-09-13)
A mediatorless glucose biosensor was developed by the immobilization of glucose oxidase (GOx) to graphene-functionalized glassy carbon electrode (GCE). The surface of GCE was functionalized with graphene by incubating it with graphene dispersed in 3-aminopropyltriethoxysilane (APTES), which acted both as

Articles

Atomic Layer Deposition (ALD) technology ensures uniform coating on complex 3D surfaces with precise chemisorption cycles.

Nanocomposite Coatings with Tunable Properties Prepared by Atomic Layer Deposition

Silica's versatility spans various industries, including biomedical applications.

Thin film photovoltaic devices have become increasingly important in efficiently harnessing solar energy to meet consumer demand.

See All

Our team of scientists has experience in all areas of research including Life Science, Material Science, Chemical Synthesis, Chromatography, Analytical and many others.

Contact Technical Service