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Design and synthesis of new 1D and 2D R-isophthalic acid-based coordination polymers (R = hydrogen or bromine).

Design and synthesis of new 1D and 2D R-isophthalic acid-based coordination polymers (R = hydrogen or bromine).

Chimia (2013-08-16)

Ren Zhang, Qihan Gong, Thomas J Emge, Debasis Banerjee, Jing Li

RESUMEN

Three new R-isophthalic acid-based (R = H or Br) coordination polymers have been designed and synthesized. By changing the N-containing ligand in the system, we are able to tune the dimensionality of coordination polymers from one-dimension (1D) to two-dimensions (2D) with the same basic building unit. Also, different metal ions can be incorporated into the same structures. Compound 1 [Cu(bipa)(py)2]·0.5(H2O) (H2bipa = 5-bromoisophthalic acid; py = pyridine) and compound 2 [Co(bipa)(py)2] are 1D chain structures. Compound 3 [Cu8(ipa)8(bpe)8]·2(bpe)·4(H2O) (bpe=1,2-bis(4-pyridyl)ethane) is a 2D layered structure.

MATERIALES

Referencia del producto

Marca

Descripción del producto

Sigma-Aldrich

Bromine, ACS reagent, ≥99.5%

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Bromine, reagent grade

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Copper, powder, 99.999% trace metals basis

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Copper, foil, thickness 0.25 mm, 99.98% trace metals basis

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Copper, powder, <425 μm, 99.5% trace metals basis

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Bromine, ≥99.99% trace metals basis

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Isophthalic acid, 99%

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Copper, wire, diam. 1.0 mm, ≥99.9%

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Copper, powder (spheroidal), 10-25 μm, 98%

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Copper, nanopowder, 40-60 nm particle size (SAXS), ≥99.5% trace metals basis

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Copper, powder, <75 μm, 99%

Sigma-Aldrich

Copper, wire, diam. 0.25 mm, 99.999% trace metals basis

Sigma-Aldrich

Copper, foil, thickness 0.025 mm, 99.98% trace metals basis

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Copper, nanopowder, 60-80 nm particle size (SAXS), ≥99.5% trace metals basis

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Copper, powder (dendritic), <45 μm, 99.7% trace metals basis

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Copper, foil, ≥99.8% (complexometric)

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Copper, turnings, purum p.a., ≥99.0%

Sigma-Aldrich

Copper, foil, thickness 0.5 mm, 99.98% trace metals basis

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Copper, wire, diam. 0.64 mm, 99.995% trace metals basis

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Copper, beads, 2-8 mm, 99.9995% trace metals basis

Sigma-Aldrich

Copper, foil, thickness 1.0 mm, 99.999% trace metals basis

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Copper, shot, −3-+14 mesh, 99%

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Copper, wire, diam. 2.0 mm, 99.999% trace metals basis

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Copper, ACS reagent, granular, 10-40 mesh, ≥99.90%

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Copper, beads, 2-8 mm, ≥99.99% trace metals basis

Sigma-Aldrich

Hydrogen, ≥99.999%

Copper (S, P), BCR^®, certified reference material, chips

Copper, IRMM^®, certified reference material, 0.5 mm wire

Copper, IRMM^®, certified reference material, 0.1 mm foil

Continuous cast copper (O), BCR^®, certified reference material, rod