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767484

Sigma-Aldrich

Nickel

sputtering target, diam. × thickness 2.00 in. × 0.25 in., 99.95% trace metals basis

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About This Item

Empirical Formula (Hill Notation):
Ni
CAS Number:
7440-02-0
Molecular Weight:
58.69
EC Number:
231-111-4
MDL number:
MFCD00011137
UNSPSC Code:
12352103
PubChem Substance ID:
329767317
NACRES:
NA.23

Quality Level

100

Assay

99.95% trace metals basis

form

solid

reaction suitability

core: nickel

resistivity

6.97 μΩ-cm, 20°C

diam. × thickness

2.00 in. × 0.25 in.

bp

2732 °C (lit.)

mp

1453 °C (lit.)

density

8.9 g/mL at 25 °C (lit.)

SMILES string

[Ni]

InChI

1S/Ni

InChI key

PXHVJJICTQNCMI-UHFFFAOYSA-N

Related Categories

Application

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.

Pictograms

Health hazardExclamation mark
GHS08,GHS07

Signal Word

Danger

Hazard Statements

H317,H351,H372

Hazard Classifications

Carc. 2 - Skin Sens. 1 - STOT RE 1

Storage Class Code

6.1D - Non-combustible acute toxic Cat.3 / toxic hazardous materials or hazardous materials causing chronic effects

WGK

WGK 2

Flash Point(F)

Not applicable

Flash Point(C)

Not applicable

Certificates of Analysis (COA)

Search for Certificates of Analysis (COA) by entering the products Lot/Batch Number. Lot and Batch Numbers can be found on a product’s label following the words ‘Lot’ or ‘Batch’.

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Cognizance of the mechanical properties of nickel-titanium archwires is necessary for the management of orthodontic therapy with fixed appliances. Acting on the periodontium with forces that are too heavy may lead to such complications as: pain, tooth root resorption and
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