For product 651834, the etching process can be accelerated by raising the temperature and/or enhancing the rate of stirring or agitation during the process. The supplier recommends an operating temperature range of 20-80°C, with 30-40°C being the most common. Additionally, the rate will approximately double with every 10°C increase in temperature.
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grade
standard
Quality Level
composition
volatiles, 85%
color
clear yellow-orange
bp
100 °C/1 atm
density
1.16 g/mL at 25 °C
Related Categories
General description
Nichrome etchant is a high purity etching system that is a mixture of ceric ammonium nitrate and nitric acid. It can be used to etch the nickel and chromium alloy.[1]
Application
Ceric ammonium nitrate-based etchant. Etches Al, Cr, Cu, Ni, GaAs. Surface oxidizes Si, Ta/TaN. Etch rate of 50 Å/sec @ 40 °C. Etches cleanly with only a deionized water rinse needed.
For use at room temperature or elevated temperature. Etches cleanly, eliminating need for an intermediate rinse.
Nichrome etchant is used in the fabrication of microheater patterns of polydimethyl siloxane (PDMS), silica (SiO2) and glass substrates, which can be further used in the fabrication of flow sensors.[2] It may also be used to etch out nickel (Ni) from the electroplated Ni on amorphous silica wafers.[3]
Features and Benefits
Designed for etching nichrome thin films used in microelectronic applications. Compatible with both positive and negative photoresists and provides fine-line control with minimal undercutting. Filtered to 0.2 micron to remove particlulates and composed of semiconductor grade materials.
Signal Word
Danger
Hazard Statements
Precautionary Statements
Hazard Classifications
Aquatic Chronic 2 - Eye Dam. 1 - Met. Corr. 1 - Ox. Liq. 2 - Skin Corr. 1B - Skin Sens. 1
Supplementary Hazards
Storage Class Code
5.1B - Oxidizing hazardous materials
WGK
WGK 3
Flash Point(F)
Not applicable
Flash Point(C)
Not applicable
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Simulation and feasibility study of flow sensor on flexible polymer for healthcare application.
Maji D and Das S
IEEE Transactions on Bio-Medical Engineering, 60(12), 3298-3305 (2013)
Perfectly plastic flow in silica glass.
Kermouche G, et al.
Acta Materialia, 114(12), 146-153 (2016)
Etch rates for micromachining processing-Part II.
Williams KR, et al.
Journal of Microelectromechanical Systems : A Joint IEEE and ASME Publication on Microstructures, Microactuators, Microsensors, and Microsystems, 12(6), 761-778 (2003)
Protocols
Photoresist kit offers pre-weighed chemical components for lithographic processes, with separate etchants for various substrate choices.
Photoresist kit offers pre-weighed chemical components for lithographic processes, with separate etchants for various substrate choices.
Photoresist kit offers pre-weighed chemical components for lithographic processes, with separate etchants for various substrate choices.
Photoresist kit offers pre-weighed chemical components for lithographic processes, with separate etchants for various substrate choices.
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Is there a faster method to etch Nichrome Foil than soaking 651834 at room temperature?
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