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651796

Sigma-Aldrich

Negative photoresist I

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About This Item

Numéro CAS:
9003-31-0
Numéro MDL:
MFCD00084438
Code UNSPSC :
41116107
Nomenclature NACRES :
NA.23

Poids mol.

average Mw 60,000-70,000 (polyisoprene)

Niveau de qualité

100

Composition

solids, 27-29 wt. %

Constante diélectrique

2.4

Tension de surface

29.2 dyn/cm

Viscosité

465-535 cP(25 °C)

pb

122-142 °C (lit.)

Densité

0.89 g/mL at 25 °C (lit.)

λmax

310-480 nm

Température de stockage

2-8°C

Chaîne SMILES 

O1C(OCC(C1)(C)C)CCCCCCCC

InChI

1S/C14H28O2/c1-4-5-6-7-8-9-10-13-15-11-14(2,3)12-16-13/h13H,4-12H2,1-3H3

Clé InChI

UBZVSDZJBLSIJG-UHFFFAOYSA-N

Catégories apparentées

Description générale

A stabilized, purified photoresist which exhibits superior resolution, adhesion, etch resistance and low pinhole density.
Available as part of Negative Photoresist kit 654892

Pictogrammes

FlameHealth hazardExclamation mark
GHS02,GHS08,GHS07

Mention d'avertissement

Danger

Classification des risques

Acute Tox. 4 Dermal - Acute Tox. 4 Inhalation - Aquatic Chronic 3 - Asp. Tox. 1 - Eye Irrit. 2 - Flam. Liq. 3 - Repr. 1B - Skin Irrit. 2 - STOT SE 3

Organes cibles

Respiratory system

Code de la classe de stockage

3 - Flammable liquids

Classe de danger pour l'eau (WGK)

WGK 3

Point d'éclair (°F)

75.2 °F - closed cup

Point d'éclair (°C)

24 °C - closed cup

Équipement de protection individuelle

Eyeshields, Faceshields, Gloves, type ABEK (EN14387) respirator filter

Faites votre choix parmi les versions les plus récentes :

Certificats d'analyse (COA)

Lot/Batch Number
MKCK5970
MKCJ2028
MKCG8986
MKCJ0922
MKCF2182

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Si vous avez besoin d'une version particulière, vous pouvez rechercher un certificat spécifique par le numéro de lot.

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Retrouvez la documentation relative aux produits que vous avez récemment achetés dans la Bibliothèque de documents.

Consulter la Bibliothèque de documents

Gérald Guérin et al.
Journal of the American Chemical Society, 130(44), 14763-14771 (2008-10-14)
In alkane solvents, poly(isoprene-b-ferrocenyldimethylsilane) (PI-b-PFS) block copolymer forms fiberlike micelles, which show intriguing similarities with biological fibers such as amyloid fibers. Both systems exhibit fiber growth by a nucleated self-assembly mechanism and rapidly fragment upon exposure to the shear forces
Thomas Schmidt et al.
BMC biochemistry, 11, 11-11 (2010-02-23)
Natural rubber is a biopolymer with exceptional qualities that cannot be completely replaced using synthetic alternatives. Although several key enzymes in the rubber biosynthetic pathway have been isolated, mainly from plants such as Hevea brasiliensis, Ficus spec. and the desert
S M Al-Salem et al.
Journal of hazardous materials, 172(2-3), 1690-1694 (2009-08-29)
Thermo-chemical treatments (mainly pyrolysis) directed towards energy and products recovery provide a very promising alternative to open space disposal or landfilling, reducing in the process hazardous waste and potential contamination to soil and water resources. In this communication, we present
Janina Post et al.
Plant physiology, 158(3), 1406-1417 (2012-01-13)
Certain Taraxacum species, such as Taraxacum koksaghyz and Taraxacum brevicorniculatum, produce large amounts of high-quality natural rubber in their latex, the milky cytoplasm of specialized cells known as laticifers. This high-molecular mass biopolymer consists mainly of poly(cis-1,4-isoprene) and is deposited
Wen-Yu Chai et al.
Chemistry, an Asian journal, 7(1), 143-155 (2011-10-29)
The novel double-stage convergent synthesis of a new class of polyisoprene terpenoid (PIPTP) dendrons is described. PIPTP dendrons bear a highly branched aliphatic hydrocarbon skeleton and a hydrophilic hydroxy focal point functionality. These dendrons have the specific formula C((5×2)(G+1)(-5))H((5×2)(G+2)(-8))O, and
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Protocoles

Negative Photoresist Procedure

Photoresist kit offers pre-weighed chemical components for lithographic processes, with separate etchants for various substrate choices.

Negative Photoresist Procedure

Photoresist kit offers pre-weighed chemical components for lithographic processes, with separate etchants for various substrate choices.

Negative Photoresist Procedure

Photoresist kit offers pre-weighed chemical components for lithographic processes, with separate etchants for various substrate choices.

Negative Photoresist Procedure

Photoresist kit offers pre-weighed chemical components for lithographic processes, with separate etchants for various substrate choices.

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