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D213705

Sigma-Aldrich

Diphenylsilanediol

95%

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About This Item

Linear Formula:
(C6H5)2Si(OH)2
CAS Number:
Molecular Weight:
216.31
Beilstein:
2523445
EC Number:
MDL number:
UNSPSC Code:
12352103
PubChem Substance ID:
NACRES:
NA.23

vapor density

>1 (vs air)

Quality Level

Assay

95%

form

powder

SMILES string

O[Si](O)(c1ccccc1)c2ccccc2

InChI

1S/C12H12O2Si/c13-15(14,11-7-3-1-4-8-11)12-9-5-2-6-10-12/h1-10,13-14H

InChI key

OLLFKUHHDPMQFR-UHFFFAOYSA-N

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General description

Diphenylsilanediol(DPSD) is an alkoxysilane that is used as a silane based precusor in the synthesis of organosiloxane based resins.

Application

DPSD may be used as a precursor in the synthesis of linear vinyl oligosiloxane resins which can be potentially used in the fabrication of thermally resistant light emitting diode(LED) encapsulant. Mercaptopropyl-phenyl-oligosiloxane and phenyl-vinyl-oligosiloxane may be synthesized by using DPSD which can further be used as a thiolene derived dielectric layer for organic thin film transistors.

Pictograms

Flame

Signal Word

Danger

Hazard Statements

Precautionary Statements

Hazard Classifications

Flam. Sol. 1

Storage Class Code

4.1B - Flammable solid hazardous materials

WGK

WGK 1

Flash Point(F)

127.4 °F - closed cup

Flash Point(C)

53 °C - closed cup

Personal Protective Equipment

dust mask type N95 (US), Eyeshields, Gloves

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Thiol-Ene Reaction Derived Sol-Gel Hybrid Dielectric Layer for Oragnic Thin Film Transistors.
Kim J, et al.
ECS Transactions, 50(4), 83-88 (2013)
High color rendering white light-emitting diodes based on a green silicate phosphor mixed with a red dye-bridged hybrid.
Kwak S, et al.
Royal Society of Chemistry Advances, 2(32), 12371-12377 (2012)
Hyeon-Gyun Im et al.
ACS applied materials & interfaces, 12(50), 56462-56469 (2020-12-02)
Metal nanowires (NWs) are promising transparent conducting electrode (TCE) materials because of their excellent optoelectrical performance, intrinsic mechanical flexibility, and large-scale processability. However, the surface roughness, thermal/chemical instability, and limited electrical conductivity associated with empty spaces between metal NWs are
Sol-gel synthesized linear oligosiloxane-based hybrid material for a thermally-resistant light emitting diode (LED) encapsulant.
Bae J, et al.
Royal Society of Chemistry Advances, 3(23), 8871-8877 (2013)
Mechanism and nanosize products of the sol-gel reaction using diphenylsilanediol and 3-methacryloxypropyltrimethoxysilane as precursors.
Kim SY, et al.
The Journal of Physical Chemistry, 109(19), 9397-9403 (2005)

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