Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.
Journal of nanoscience and nanotechnology, 13(7), 4601-4607 (2013-08-02)
Nanocytalline TiN films were deposited on non-alkali glass and Al substrates by reactive DC magnetron sputtering (DCMS) with an electromagnetic field system (EMF). The microstructure and corrosion resistance of the TiN-coated Al substrates were estimated by X-ray diffraction (XRD), scanning
Journal of nanoscience and nanotechnology, 13(8), 5807-5810 (2013-07-26)
In this study, hydroxyapatite (HA) was coated on anodized titanium (Ti) surfaces through radio frequency magnetron sputtering in order to improve biological response of the titanium surface. All the samples were blasted with resorbable blasting media (RBM). RBM-blasted Ti surface
Journal of nanoscience and nanotechnology, 13(7), 4565-4572 (2013-08-02)
Titanium nitride (TiN)/niobium nitride (NbN) nanostructured multilayer coatings were prepared by DC reactive magnetron sputtering method using the combination of a titanium and niobium target and an Ar-N2 mixture discharge gas on to 316L stainless steel substrates. The coatings showed
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