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45348

Sigma-Aldrich

Epoxy embedding medium, accelerator

≥95% (NT)

Synonym(s):

2,4,6-Tris(dimethylaminomethyl)phenol, Epon™ DMP 30 substitute, DMP-30

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About This Item

Linear Formula:
[(CH3)2NCH2]3C6H2OH
CAS Number:
90-72-2
Molecular Weight:
265.39
Beilstein:
795751
EC Number:
202-013-9
MDL number:
MFCD00008330
UNSPSC Code:
12352100
PubChem Substance ID:
57650300
NACRES:
NA.47

vapor density

>1 (vs air)

vapor pressure

<0.01 mmHg ( 21 °C)

Assay

≥95% (NT)

form

solid

color

colorless to light yellow

refractive index

n20/D 1.516 (lit.)
n20/D 1.517

bp

130-135 °C/1 mmHg (lit.)

density

0.969 g/mL at 25 °C (lit.)

application(s)

hematology
histology

storage temp.

2-8°C

SMILES string

CN(C)Cc1cc(CN(C)C)c(O)c(CN(C)C)c1

InChI

1S/C15H27N3O/c1-16(2)9-12-7-13(10-17(3)4)15(19)14(8-12)11-18(5)6/h7-8,19H,9-11H2,1-6H3

InChI key

AHDSRXYHVZECER-UHFFFAOYSA-N

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Application

Epoxy embedding medium, accelerator is used according to the protocol provided for Epoxy Embedding Medium kit, Prod. No. 45359 available on-line. The embedding media is used for electron microscopy.

Legal Information

Epon is a trademark of Hexion, Inc.

related product

Product No.
Description
Pricing

Pictograms

CorrosionExclamation mark
GHS05,GHS07

Signal Word

Danger

Hazard Statements

H302,H314

Hazard Classifications

Acute Tox. 4 Oral - Eye Dam. 1 - Skin Corr. 1B

Storage Class Code

8A - Combustible corrosive hazardous materials

WGK

WGK 1

Flash Point(F)

300.2 °F - closed cup

Flash Point(C)

149 °C - closed cup

Personal Protective Equipment

dust mask type N95 (US), Eyeshields, Gloves

Certificates of Analysis (COA)

Search for Certificates of Analysis (COA) by entering the products Lot/Batch Number. Lot and Batch Numbers can be found on a product’s label following the words ‘Lot’ or ‘Batch’.

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Masashi Yamaguchi et al.
Journal of electron microscopy, 58(4), 261-266 (2009-03-18)
A smart and efficient method for freeze substitution and serial sectioning of yeast cells is described. Yeast cells were placed in a single layer between two copper disks, rapidly frozen, freeze substituted and embedded in an epoxy resin. The cell
S H Brorson
Micron (Oxford, England : 1993), 29(2-3), 89-95 (1998-07-31)
The purpose of this study was to examine how antigen retrieval affected the yield of immunogold labeling on epoxy sections based on embedding with different amounts of accelerator. The concentration of accelerator DMP-30 (tri(dimethyl amino methyl) phenol) was varied in
Contact allergy to 2,4,6-tris(dimethylaminomethyl)phenol.
R Brooke et al.
Contact dermatitis, 38(5), 284-285 (1998-07-17)
A Schaper et al.
FEBS letters, 355(1), 91-95 (1994-11-21)
We present recent advances in DNA specimen preparation technique for scanning force microscopy (SFM) based on spreading on mica in the presence of cationic and non-ionic detergents. Reproducible DNA imaging in air and in n-propanol has been achieved in the
L Kanerva et al.
International journal of dermatology, 35(12), 852-856 (1996-12-01)
Epoxy resin compounds (ERC) include a large number of sensitizing chemicals such as epoxy resins (ER), hardeners (curing agents), and reactive diluents. Allergic contact dermatitis (ACD) caused by ERCS is often occupational. We report a patient, sensitized to a hardener
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