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Key Documents

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45348

Sigma-Aldrich

Epoxy embedding medium, accelerator

≥95% (NT)

Sinónimos:

2,4,6-Tris(dimethylaminomethyl)phenol, Epon™ DMP 30 substitute, DMP-30

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About This Item

Fórmula lineal:
[(CH3)2NCH2]3C6H2OH
Número de CAS:
90-72-2
Peso molecular:
265.39
Beilstein/REAXYS Number:
795751
EC Number:
202-013-9
MDL number:
MFCD00008330
UNSPSC Code:
12352100
PubChem Substance ID:
57650300
NACRES:
NA.47

vapor density

>1 (vs air)

vapor pressure

<0.01 mmHg ( 21 °C)

assay

≥95% (NT)

form

solid

color

colorless to light yellow

refractive index

n20/D 1.516 (lit.)
n20/D 1.517

bp

130-135 °C/1 mmHg (lit.)

density

0.969 g/mL at 25 °C (lit.)

application(s)

hematology
histology

storage temp.

2-8°C

SMILES string

CN(C)Cc1cc(CN(C)C)c(O)c(CN(C)C)c1

InChI

1S/C15H27N3O/c1-16(2)9-12-7-13(10-17(3)4)15(19)14(8-12)11-18(5)6/h7-8,19H,9-11H2,1-6H3

InChI key

AHDSRXYHVZECER-UHFFFAOYSA-N

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Application

Epoxy embedding medium, accelerator is used according to the protocol provided for Epoxy Embedding Medium kit, Prod. No. 45359 available on-line. The embedding media is used for electron microscopy.

Legal Information

Epon is a trademark of Hexion, Inc.

related product

Referencia del producto
Descripción
Precios

03989

Eukitt® Quick-hardening mounting medium, for microscopy

05393

Eukitt® UV, for microscopy

pictograms

CorrosionExclamation mark
GHS05,GHS07

signalword

Danger

hcodes

H302,H314

Hazard Classifications

Acute Tox. 4 Oral - Eye Dam. 1 - Skin Corr. 1B

Storage Class

8A - Combustible corrosive hazardous materials

wgk_germany

WGK 1

flash_point_f

300.2 °F - closed cup

flash_point_c

149 °C - closed cup

ppe

Faceshields, Gloves, Goggles, type ABEK (EN14387) respirator filter

Certificados de análisis (COA)

Busque Certificados de análisis (COA) introduciendo el número de lote del producto. Los números de lote se encuentran en la etiqueta del producto después de las palabras «Lot» o «Batch»

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Masashi Yamaguchi et al.
Journal of electron microscopy, 58(4), 261-266 (2009-03-18)
A smart and efficient method for freeze substitution and serial sectioning of yeast cells is described. Yeast cells were placed in a single layer between two copper disks, rapidly frozen, freeze substituted and embedded in an epoxy resin. The cell
S H Brorson
Micron (Oxford, England : 1993), 29(2-3), 89-95 (1998-07-31)
The purpose of this study was to examine how antigen retrieval affected the yield of immunogold labeling on epoxy sections based on embedding with different amounts of accelerator. The concentration of accelerator DMP-30 (tri(dimethyl amino methyl) phenol) was varied in
A Schaper et al.
FEBS letters, 355(1), 91-95 (1994-11-21)
We present recent advances in DNA specimen preparation technique for scanning force microscopy (SFM) based on spreading on mica in the presence of cationic and non-ionic detergents. Reproducible DNA imaging in air and in n-propanol has been achieved in the
L Kanerva et al.
International journal of dermatology, 35(12), 852-856 (1996-12-01)
Epoxy resin compounds (ERC) include a large number of sensitizing chemicals such as epoxy resins (ER), hardeners (curing agents), and reactive diluents. Allergic contact dermatitis (ACD) caused by ERCS is often occupational. We report a patient, sensitized to a hardener
Contact allergy to 2,4,6-tris(dimethylaminomethyl)phenol.
R Brooke et al.
Contact dermatitis, 38(5), 284-285 (1998-07-17)
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