651834

Nichrome etchant

standard

• Numéro MDL: MFCD07370976
• Code UNSPSC : 12161700
• Nomenclature NACRES : NA.23

Propriétés

• Qualité: standard
• Niveau de qualité: 100
• Composition: volatiles, 85%
• Couleur: clear yellow-orange
• Point d'ébullition: 100 °C/1 atm
• Densité: 1.16 g/mL at 25 °C

Description

Description générale

Nichrome etchant is a high purity etching system that is a mixture of ceric ammonium nitrate and nitric acid. It can be used to etch the nickel and chromium alloy.

Application

Ceric ammonium nitrate-based etchant. Etches Al, Cr, Cu, Ni, GaAs. Surface oxidizes Si, Ta/TaN. Etch rate of 50 Å/sec @ 40 °C. Etches cleanly with only a deionized water rinse needed.

Nichrome etchant is used in the fabrication of microheater patterns of polydimethyl siloxane (PDMS), silica (SiO₂) and glass substrates, which can be further used in the fabrication of flow sensors. It may also be used to etch out nickel (Ni) from the electroplated Ni on amorphous silica wafers.

For use at room temperature or elevated temperature. Etches cleanly, eliminating need for an intermediate rinse.

Caractéristiques et avantages

Designed for etching nichrome thin films used in microelectronic applications. Compatible with both positive and negative photoresists and provides fine-line control with minimal undercutting. Filtered to 0.2 micron to remove particlulates and composed of semiconductor grade materials.

Informations sur la sécurité

• Pictogrammes: GHS03,GHS05,GHS07,GHS09
• Mention d'avertissement: Danger
• Mentions de danger: H272,H290,H314,H317,H411
• Conseils de prudence: P210 - P220 - P273 - P280 - P303 + P361 + P353 - P305 + P351 + P338
• Classification des risques: Aquatic Chronic 2 - Eye Dam. 1 - Met. Corr. 1 - Ox. Liq. 2 - Skin Corr. 1B - Skin Sens. 1
• Risques supp: EUH071
• Code de la classe de stockage: 5.1B - Oxidizing hazardous materials
• Classe de danger pour l'eau (WGK): WGK 3
• Point d'éclair (°F): Not applicable
• Point d'éclair (°C): Not applicable