643262

Gold coated silicon wafer

99.999% (Au), layer thickness 1000 Å, 99.99% (Ti)

• Synonyme(s) : gold coated silicon, gold coated wafer
• Formule linéaire : Au
• Poids moléculaire : 196.97
• NACRES: NA.23
• PubChem Substance ID: 329759955
• UNSPSC Code: 12352103
• MDL number: MFCD00003436

Propriétés

• Quality Segment: 100
• assay: 99.99% (Ti), 99.999% (Au)
• diam. × thickness: 4 in. × 500 μm
• layer thickness: 1000 Å
• matrix attachment: Titanium, as adhesion layer used to bind the gold to the silicon wafer.
• SMILES string: [Au]
• InChI: 1S/Au
• InChI key: PCHJSUWPFVWCPO-UHFFFAOYSA-N

Description

General description

The product is highly crystalline, with <111> orientation gold and <100> orientation silicon wafer is used. Titanium is used as an adhesion layer to bind gold to the silicon wafer.

Our gold-coated silicon wafers use electron-beam lithography to form amorphous layers (50Å of titanium followed by 1000Å of gold) on top of the silicon wafer.

Application

Gold coated silicon wafers may be used in soft lithography for micro and nanoscale patterning.

Packaging

Packaging 1 set in single wafer shipper

Informations sur la sécurité

• Classe de stockage: 11 - Combustible Solids
• Que se passe-t-il ?: WGK 3
• Point d'éclair (°F): Not applicable
• Point d'éclair (°C): Not applicable