material
gold/chromium electrode (Au/Cr)
description
die layer thickness 300 nm SiO2
die layer thickness 36 nm boron nitride
electrode layer thickness 60 nm gold
feature
BN/SiO2 coating
optimized for hall
packaging
pkg of 16 non-diced devices
manufacturer/tradename
HF101
die thickness
525 μm , silicon
electrode size
10 nm , chrome
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