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411167

Sigma-Aldrich

Bisphenol A glycerolate (1 glycerol/phenol) diacrylate

contains MEHQ as inhibitor

Synonym(s):

2,2-Bis[4-(3-acryloyloxy-2-hydroxypropoxy)phenyl]propane, 2,2-Bis[acryloyloxy(2′-hydroxypropyloxy)phenyl]propane, Bisphenol A glycerolate diacrylate

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About This Item

Empirical Formula (Hill Notation):
C27H32O8
CAS Number:
4687-94-9
Molecular Weight:
484.54
EC Number:
225-144-3
MDL number:
MFCD01317012
UNSPSC Code:
12162002
PubChem Substance ID:
24865731
NACRES:
NA.23

contains

MEHQ as inhibitor
250-500 ppm MEHQ as inhibitor

refractive index

n20/D 1.557 (lit.)

viscosity

2000-4000 cP(65 °C)(lit.)

acid number

<5 mg KOH/g

density

1.18 g/mL at 25 °C (lit.)

SMILES string

CC(C)(c1ccc(OCC(O)COC(=O)C=C)cc1)c2ccc(OCC(O)COC(=O)C=C)cc2

InChI

1S/C27H32O8/c1-5-25(30)34-17-21(28)15-32-23-11-7-19(8-12-23)27(3,4)20-9-13-24(14-10-20)33-16-22(29)18-35-26(31)6-2/h5-14,21-22,28-29H,1-2,15-18H2,3-4H3

InChI key

VZTQQYMRXDUHDO-UHFFFAOYSA-N

Related Categories

Application

UV curable cross-linking agent. Component of curable inks, coatings, varnishes and lacquers.

Features and Benefits

High viscosity, non-volatile, difunctional acrylate. Gives fast cure speeds, low odor and low volatility.

Physical form

epoxy acrylate oligomer

Pictograms

Exclamation mark
GHS07

Signal Word

Warning

Hazard Statements

H317

Hazard Classifications

Skin Sens. 1

Storage Class Code

10 - Combustible liquids

WGK

WGK 3

Flash Point(F)

235.4 °F - closed cup

Flash Point(C)

113 °C - closed cup

Personal Protective Equipment

dust mask type N95 (US), Eyeshields, Gloves

Certificates of Analysis (COA)

Search for Certificates of Analysis (COA) by entering the products Lot/Batch Number. Lot and Batch Numbers can be found on a product’s label following the words ‘Lot’ or ‘Batch’.

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B Björkner
Acta dermato-venereologica, 61(1), 7-10 (1981-01-01)
One commonly used prepolymer in ultraviolet (UV) curing inks is epoxy acrylate. Of 6 men with dermatitis contracted from UV-curing inks, 2 had positive patch test reaction to epoxy acrylate. None reacted to the chemically related bisphenol A dimethacrylate. The
D L Holness et al.
Contact dermatitis, 28(4), 216-219 (1993-04-01)
Epoxy resin of the bisphenol A type (ERBA) is a common cause of occupational contact dermatitis. 167 patients with a history of potential exposure were patch tested with epoxy resin (molecular weight 340) (ERBAM) 1% in pet. and with a
Kristiina Aalto-Korte et al.
Contact dermatitis, 61(1), 9-21 (2009-08-08)
Contact allergy to epoxy (meth)acrylates, 2,2-bis[4-(2-hydroxy-3-methacryloxypropoxy) phenyl]propane (bis-GMA), 2,2-bis[4-(2-hydroxy-3-acryloxypropoxy)phenyl]-propane (bis-GA), 2,2-bis[4-(methacryl-oxyethoxy)phenyl] propane (bis-EMA), 2,2-bis[4-(methacryloxy)phenyl]-propane (bis-MA), and glycidyl methacrylate (GMA) is often manifested together with contact allergy to diglycidyl ether of bisphenol A (DGEBA) epoxy resin. To analyse patterns of concomitant
Han N Lee et al.
American journal of contact dermatitis : official journal of the American Contact Dermatitis Society, 13(3), 108-115 (2002-08-08)
The study's objective was 2-fold: first, to evaluate the potential cross-reactivity between Bis-A epoxy resins and epoxy acrylates and second, to study the cross reactivity between Bis-A epoxy resins and newer Bis-F epoxy resins in patients with allergic contact dermatitis
Li Li et al.
Electrophoresis, 33(16), 2591-2597 (2012-08-18)
Manufacturing materials are an essential element for the fabrication of microfluidic chips. PDMS, the most widely used polymeric material, is associated with apparent disadvantages such as hydrophobic nature, while other materials also suffer from some limitations. In this paper, a
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