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Low-Temperature Wafer-Scale Deposition of Continuous 2D SnS2 Films.

Small (Weinheim an der Bergstrasse, Germany) (2018-04-20)
Miika Mattinen, Peter J King, Leonid Khriachtchev, Kristoffer Meinander, James T Gibbon, Vin R Dhanak, Jyrki Räisänen, Mikko Ritala, Markku Leskelä
RÉSUMÉ

Semiconducting 2D materials, such as SnS2 , hold immense potential for many applications ranging from electronics to catalysis. However, deposition of few-layer SnS2 films has remained a great challenge. Herein, continuous wafer-scale 2D SnS2 films with accurately controlled thickness (2 to 10 monolayers) are realized by combining a new atomic layer deposition process with low-temperature (250 °C) postdeposition annealing. Uniform coating of large-area and 3D substrates is demonstrated owing to the unique self-limiting growth mechanism of atomic layer deposition. Detailed characterization confirms the 1T-type crystal structure and composition, smoothness, and continuity of the SnS2 films. A two-stage deposition process is also introduced to improve the texture of the films. Successful deposition of continuous, high-quality SnS2 films at low temperatures constitutes a crucial step toward various applications of 2D semiconductors.

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Tin(IV) acetate