225452

Bis(triphenylphosphine)palladium(II) diacetate

98%

• Sinónimos: Bis(acetato)bis(triphenylphosphine)palladium(II), Palladium(II)bis(triphenylphosphine) diacetate, Pd(OAc)₂(PPh₃)₂
• Fórmula lineal: [(C₆H₅)₃P]₂Pd(CH₃COO)₂
• Número de CAS: 14588-08-0
• Peso molecular: 749.08
• Número CE: 238-628-4
• Número MDL: MFCD00010013
• Código UNSPSC: 12352300
• ID de la sustancia en PubChem: 24853498
• NACRES: NA.22

Propiedades

• Ensayo: 98%
• idoneidad de la reacción: core: palladium; reaction type: Buchwald-Hartwig Cross Coupling Reaction; reaction type: Cross Couplings; reaction type: Heck Reaction; reaction type: Hiyama Coupling; reaction type: Negishi Coupling; reaction type: Sonogashira Coupling; reaction type: Stille Coupling; reaction type: Suzuki-Miyaura Coupling; reagent type: catalyst
• mp: 136 °C (dec.) (lit.)
• cadena SMILES: CC(=O)O[Pd]OC(C)=O.c1ccc(cc1)P(c2ccccc2)c3ccccc3.c4ccc(cc4)P(c5ccccc5)c6ccccc6
• InChI: 1S/2C18H15P.2C2H4O2.Pd/c2*1-4-10-16(11-5-1)19(17-12-6-2-7-13-17)18-14-8-3-9-15-18;2*1-2(3)4;/h2*1-15H;2*1H3,(H,3,4);/q;;;;+2/p-2
• Clave InChI: UVBXZOISXNZBLY-UHFFFAOYSA-L

Descripción

Aplicación

Bis(triphenylphosphine)palladium(II) diacetate can be used as a catalyst for C-C bond formation via Sonogashira coupling, Negishi coupling, Heck coupling, and Suzuki coupling reaction.[1][2][3]
It can also be used as a catalyst to synthesize:

• Pyrido[1,2-a]benzimidazole derivatives by electro-oxidative intramolecular C-H/N-H annulation reaction.[3]
• α, β-Unsaturated carboxylic acids by hydroxycarbonylation of vinyl triflates.[4]
• Secondary imides by C-H functionalization of aldehydes with different N-substituted N-heteroarene-2-carboxamides.[5]

Información de seguridad

• Código de clase de almacenamiento: 13 - Non Combustible Solids
• Clase de riesgo para el agua (WGK): WGK 3
• Punto de inflamabilidad (°F): Not applicable
• Punto de inflamabilidad (°C): Not applicable
• Equipo de protección personal: Eyeshields, Gloves, type N95 (US)