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164410

Sigma-Aldrich

Benzocyclobutene

97%

Synonym(s):

Bicyclo[4.2.0]octa-1,3,5-triene

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About This Item

Empirical Formula (Hill Notation):
C8H8
CAS Number:
694-87-1
Molecular Weight:
104.15
MDL number:
MFCD01321219
UNSPSC Code:
12352100
PubChem Substance ID:
24850072
NACRES:
NA.22

Assay

97%

form

liquid

refractive index

n20/D 1.541 (lit.)

bp

150 °C/748 mmHg (lit.)

density

0.957 g/mL at 25 °C (lit.)

SMILES string

C1Cc2ccccc12

InChI

1S/C8H8/c1-2-4-8-6-5-7(8)3-1/h1-4H,5-6H2

InChI key

UMIVXZPTRXBADB-UHFFFAOYSA-N

Related Categories

Application

Benzocyclobutene was used as the adhesive bonding material in adhesive wafer-level bonding technique. Photosensitive benzocyclobutene has been widely used as dielectric material in multilayer packaging applications. It was used in fabrication of high density multilayer interconnect structures using gold metallization and polymer interlayer dielectric.

Pictograms

Flame
GHS02

Signal Word

Warning

Hazard Statements

H226

Hazard Classifications

Flam. Liq. 3

Storage Class Code

3 - Flammable liquids

WGK

WGK 3

Flash Point(F)

96.8 °F - closed cup

Flash Point(C)

36 °C - closed cup

Personal Protective Equipment

dust mask type N95 (US), Eyeshields, Gloves

Certificates of Analysis (COA)

Search for Certificates of Analysis (COA) by entering the products Lot/Batch Number. Lot and Batch Numbers can be found on a product’s label following the words ‘Lot’ or ‘Batch’.

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Photosensitive benzocyclobutene for stress-buffer and passivation applications (one mask manufacturing process).
Strandjord AJG, et al.
Electronic Components and Technology Conference, 1997. Proceedings., 47th. IEEE, 47 (1997)
Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities.
Oberhammer J, et al.
Sens. Actuators, 105(3), 297-304 (2003)
Processing and microwave characterization of multilevel interconnects using benzocyclobutene dielectric.
Chinoy PB and Tajadod J.
IEEE Transactions on Components, Hybrids, and Manufacturing, 16(7), 714-719 (1993)

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