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  • Nanolithography. Large-scale nanoshaping of ultrasmooth 3D crystalline metallic structures.

Nanolithography. Large-scale nanoshaping of ultrasmooth 3D crystalline metallic structures.

Science (New York, N.Y.) (2014-12-17)
Huang Gao, Yaowu Hu, Yi Xuan, Ji Li, Yingling Yang, Ramses V Martinez, Chunyu Li, Jian Luo, Minghao Qi, Gary J Cheng
摘要

We report a low-cost, high-throughput benchtop method that enables thin layers of metal to be shaped with nanoscale precision by generating ultrahigh-strain-rate deformations. Laser shock imprinting can create three-dimensional crystalline metallic structures as small as 10 nanometers with ultrasmooth surfaces at ambient conditions. This technique enables the successful fabrications of large-area, uniform nanopatterns with aspect ratios as high as 5 for plasmonic and sensing applications, as well as mechanically strengthened nanostructures and metal-graphene hybrid nanodevices.

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石墨, powder, <20 μm, synthetic
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金, powder, <45 μm, 99.99% trace metals basis
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金, nanopowder, <100 nm particle size, 99.9% trace metals basis
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金, powder, <10 μm, ≥99.9% trace metals basis
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金, foil, thickness 0.1 mm, 99.99% trace metals basis
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镀金显微镜载片, 99.999% (Au), layer thickness 100 Å
金, rod, 50mm, diameter 3.0mm, as drawn, 99.95%
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金, wire, diam. 1.0 mm, 99.99% trace metals basis
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金, wire, diam. 0.25 mm, ≥99.9% trace metals basis
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金, foil, thickness 0.5 mm, 99.99% trace metals basis
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金, beads, 1-6 mm, 99.999% trace metals basis
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镀金盖玻片, L × W × thickness 22 mm × 22 mm × 130-170 μm, square, 99.999% (Au), layer thickness 100 Å
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金, rod, diam. 3.0 mm, 99.99% trace metals basis
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金, evaporation slug, diam. × L 0.3 cm × 0.6 cm, 99.99% trace metals basis
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镀金显微镜载片, layer thickness 1000 Å, 99.999% (Au)
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金, wire, diam. 0.1 mm, 99.99% trace metals basis
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金, foil, thickness 0.05 mm, 99.99% trace metals basis
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金, foil, thickness 0.127 mm, 99.99% trace metals basis
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金, foil, thickness 0.025 mm, 99.99% trace metals basis
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金, wire, diam. 0.5 mm, 99.99% trace metals basis
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金, wire, diam. 0.25 mm, 99.99% trace metals basis
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金, foil, thickness 0.25 mm, ≥99.9% trace metals basis
金, sphere, 20pcs, diameter 0.5mm, 99.99%
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金, wire, diam. 1.0 mm, 99.997% trace metals basis
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金, powder, <850 μm, ≥99.99% trace metals basis
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金, evaporation slug, diam. × L 0.6 cm × 0.6 cm, 99.99% trace metals basis
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金, wire, diam. 0.5 mm, 99.999% trace metals basis
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镀金盖玻片, 99.999% (Au), diam. × thickness 15 mm × 130-170 μm, layer thickness 100 Å
金, insulated wire, 2m, conductor diameter 0.05mm, insulation thickness 0.007mm, polyimide insulation, 99.99%
金, insulated wire, 5m, conductor diameter 0.125mm, insulation thickness 0.014mm, polyester insulation, 99.99%