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767484

Sigma-Aldrich

Nickel

sputtering target, diam. × thickness 2.00 in. × 0.25 in., 99.95% trace metals basis

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About This Item

Fórmula empírica (notación de Hill):
Ni
Número de CAS:
7440-02-0
Peso molecular:
58.69
EC Number:
231-111-4
MDL number:
MFCD00011137
UNSPSC Code:
12352103
PubChem Substance ID:
329767317
NACRES:
NA.23

assay

99.95% trace metals basis

form

solid

reaction suitability

core: nickel

resistivity

6.97 μΩ-cm, 20°C

diam. × thickness

2.00 in. × 0.25 in.

bp

2732 °C (lit.)

mp

1453 °C (lit.)

density

8.9 g/mL at 25 °C (lit.)

SMILES string

[Ni]

InChI

1S/Ni

InChI key

PXHVJJICTQNCMI-UHFFFAOYSA-N

Categorías relacionadas

Application

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.

pictograms

Health hazardExclamation mark
GHS08,GHS07

signalword

Danger

Hazard Classifications

Carc. 2 - Skin Sens. 1 - STOT RE 1

Storage Class

6.1D - Non-combustible acute toxic Cat.3 / toxic hazardous materials or hazardous materials causing chronic effects

wgk_germany

WGK 2

flash_point_f

Not applicable

flash_point_c

Not applicable

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Busque Certificados de análisis (COA) introduciendo el número de lote del producto. Los números de lote se encuentran en la etiqueta del producto después de las palabras «Lot» o «Batch»

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Posterior resin bonded cast metal restorations (adhesive onlays) were used in a variety of clinical scenarios including: management of tooth wear and cracked tooth, as retainers for fixed bridge work, for correction of the occlusal plane and in providing cuspal
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