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Merck

Flexible Temperature-Invariant Polymer Dielectrics with Large Bandgap.

Advanced materials (Deerfield Beach, Fla.) (2020-04-07)
Chao Wu, Ajinkya A Deshmukh, Zongze Li, Lihua Chen, Abdullah Alamri, Yifei Wang, Rampi Ramprasad, Gregory A Sotzing, Yang Cao
ABSTRACT

Flexible dielectrics operable under simultaneous electric and thermal extremes are critical to advanced electronics for ultrahigh densities and/or harsh conditions. However, conventional high-performance polymer dielectrics generally have conjugated aromatic backbones, leading to limited bandgaps and hence high conduction loss and poor energy densities, especially at elevated temperatures. A polyoxafluoronorbornene is reported, which has a key design feature in that it is a polyolefin consisting of repeating units of fairly rigid fused bicyclic structures and alkenes separated by freely rotating single bonds, endowing it with a large bandgap of ≈5 eV and flexibility, while being temperature-invariantly stable over -160 to 160 °C. At 150 °C, the polyoxafluoronorbornene exhibits an electrical conductivity two orders of magnitude lower than the best commercial high-temperature polymers, and features an unprecedented discharged energy density of 5.7 J cm-3 far outperforming the best reported flexible dielectrics. The design strategy uncovered in this work reveals a hitherto unexplored space for the design of scalable and efficient polymer dielectrics for electrical power and electronic systems under concurrent harsh electrical and thermal conditions.

MATERIALS
Product Number
Brand
Product Description

Sigma-Aldrich
3,5-Bis(trifluoromethyl)aniline, 97%
Sigma-Aldrich
exo-3,6-Epoxy-1,2,3,6-tetrahydrophthalic anhydride