Accéder au contenu
Merck

Coordination polymers constructed from oligonuclear nodes.

Chimia (2013-08-16)
Marius Andruh
RÉSUMÉ

The node-and-spacer approach is widely employed in crystal engineering to construct coordination polymers. It consists of self-assembly processes involving mononuclear cationic species and exo-dentate ligands. We enlarged this strategy using preformed homo- and heterometallic complexes as nodes. The presence of two or more metal ions within a node leads to novel network topologies, as well as to new properties, arising from the intra- and internode interactions. This paper reviews some representative examples of coordination polymers obtained in our laboratory and constructed from: i) binuclear alkoxo-bridged complexes; ii) heterometallic 3d-3d' and 3d-4f complexes.

MATÉRIAUX
Référence du produit
Marque
Description du produit

Sigma-Aldrich
Copper, powder, 99.999% trace metals basis
Sigma-Aldrich
Copper, foil, thickness 0.25 mm, 99.98% trace metals basis
Sigma-Aldrich
Copper, powder, <425 μm, 99.5% trace metals basis
Sigma-Aldrich
Copper, wire, diam. 1.0 mm, ≥99.9%
Sigma-Aldrich
Copper, powder, <75 μm, 99%
Sigma-Aldrich
Copper, nanopowder, 40-60 nm particle size (SAXS), ≥99.5% trace metals basis
Sigma-Aldrich
Copper, powder (spheroidal), 10-25 μm, 98%
Sigma-Aldrich
Copper, wire, diam. 0.25 mm, 99.999% trace metals basis
Sigma-Aldrich
Copper, foil, thickness 0.025 mm, 99.98% trace metals basis
Sigma-Aldrich
Copper, nanopowder, 60-80 nm particle size (SAXS), ≥99.5% trace metals basis
Sigma-Aldrich
Copper, turnings, purum p.a., ≥99.0%
Sigma-Aldrich
Copper, foil, ≥99.8% (complexometric)
Sigma-Aldrich
Copper, powder (dendritic), <45 μm, 99.7% trace metals basis
Sigma-Aldrich
Copper, wire, diam. 0.64 mm, 99.995% trace metals basis
Sigma-Aldrich
Copper, foil, thickness 0.5 mm, 99.98% trace metals basis
Sigma-Aldrich
Copper, shot, −3-+14 mesh, 99%
Sigma-Aldrich
Copper, foil, thickness 1.0 mm, 99.999% trace metals basis
Sigma-Aldrich
Copper, beads, 2-8 mm, 99.9995% trace metals basis
Sigma-Aldrich
Copper, wire, diam. 2.0 mm, 99.999% trace metals basis
Sigma-Aldrich
Copper, beads, 2-8 mm, ≥99.99% trace metals basis
Sigma-Aldrich
Copper, ACS reagent, granular, 10-40 mesh, ≥99.90%
Copper (S, P), BCR®, certified reference material, chips
Continuous cast copper (O), BCR®, certified reference material, rod
Copper, IRMM®, certified reference material, 0.5 mm wire
Copper (O), BCR®, certified reference material, rod
Copper, IRMM®, certified reference material, 0.1 mm foil