767484

Nickel

sputtering target, diam. × thickness 2.00 in. × 0.25 in., 99.95% trace metals basis

• Empirický vzorec (Hillův zápis): Ni
• Číslo CAS: 7440-02-0
• Molekulová hmotnost: 58.69
• NACRES: NA.23
• PubChem Substance ID: 329767317
• UNSPSC Code: 11101706
• EC Number: 231-111-4
• MDL number: MFCD00011137

Vlastnosti

• Quality Segment: 100
• assay: 99.95% trace metals basis
• form: solid
• reaction suitability: core: nickel
• resistivity: 6.97 μΩ-cm, 20°C
• diam. × thickness: 2.00 in. × 0.25 in.
• bp: 2732 °C (lit.)
• mp: 1453 °C (lit.)
• density: 8.9 g/mL at 25 °C (lit.)
• SMILES string: [Ni]
• InChI: 1S/Ni
• InChI key: PXHVJJICTQNCMI-UHFFFAOYSA-N

Popis

Application

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.

Bezpečnostní informace

• pictograms: GHS08,GHS07
• signalword: Danger
• hcodes: H317,H351,H372
• pcodes: P202 - P260 - P264 - P280 - P302 + P352 - P308 + P313
• Hazard Classifications: Carc. 2 - Skin Sens. 1 - STOT RE 1
• Skladovací třída: 6.1D - Non-combustible acute toxic Cat.3 / toxic hazardous materials or hazardous materials causing chronic effects
• wgk: WGK 2
• flash_point_f: Not applicable
• flash_point_c: Not applicable